
 Veriflex®
E Epoxy-Based Shape Memory Polymer
Cured
Veriflex
E
combines
shape
memory
properties
with
the
high
toughness
and
strength
of
epoxy.
When
heated
above
its
activation
temperature,
Veriflex
E
changes
from
a
rigid
plastic
to
an
elastic
state.
While
elastic,
it
can
be
twisted,
pulled,
bent,
and
stretched.
When
cooled,
the
polymer
hardens
and
can
maintain
its
deformed
configuration
indefinitely.
When
heated
again,
the
polymer
returns
to
the
shape
in
which
it
was
cured.
This
process
can
be
repeated
for
many
cycles
without
loss
of
the
memory
shape
or
degradation
of
the
material.
Veriflex
E
comes
as
either
a
one-part
or
two-part,
fully
formable,
thermoset
shape
memory
polymer
(SMP)
resin
system.
Engineered
with
an
activation
temperature
of
approximately
90°
C
(194
°F)
for
one-part
Veriflex
E,
and
104
°C
(219
°F)
for
two-part
Veriflex
E,
the
resin
can
be
cured
in
an
open
mold.
Epoxy
is
a
well
understood
and
commonly
used
resin
system.
It
provides
convenient
processing,
usage,
and
property
modification.
Veriflex
E
is
a
high-performance
material
formulated
from
commercially
available
resins
and
curing
agents.
It
can
be
cast
and
cured
into
a
variety
of
“memorized”
shapes,
depending
on
the
application
requirements.
Epoxy
SMP
has
a
very
sharp
modulus
transition
curve,
yielding
a
quick
recovery
to
the
“memory”
shape
upon
heating
above
the
transition
temperature.
Both
versions
of
the
resin
are
now
available
for
purchase
through
CRG's
sister
company,
CRG
Industries.
Benefits
•
Toughness
•
Unique
shape
memory
properties
•
Recovery
to
memorized
shape
after
repeated
deformation
•
Ability
to
change
from
a
rigid
polymer
to
rubbery
elastomer
•
Over
95%
(one-part
resin)
and
100%
(two-part
resin)
elongation
possible
in
elastic
state
•
Low
viscosity
for
easy
processing
(RTM
or
VARTM)
(two-part
resin)
•
Open-mold
curable
•
Aesthetic
clarity
•
Machinability
once
cured
Applications
• Customized, reusable
molds
• Deployable mechanisms and structures
• Adjustable furniture
• Reformable toys
• Customized containers, adjustable
shipping and packaging
• Actuators
• Sensors
• Space-qualifiable applications
• Removable mandrels
• Automotive uses
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