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  New
Patent Issued for High-Temp SMP
On October 2, 1007, CRG was issued a patent
for maleimide-based, high-temperature shape memory polymer.
The patent (US Pat. No. 7,276,195) describes the use of maleimide-based
SMP to form a mold for a product that requires high-temperature
cure (above 100°C and preferably less than 150°C).
The patent also discloses the range of chemical compositions
for making such a mold. In addition, it describes the process
of using that mold to aid the cured product in separating
from the mold.
This patent is part of CRG's business model
of creating an intellectual property landscape that benefits
customers and increases their competitiveness in their field
of use. (10-2-2007)
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