 CRG
Introduces Veriflex® E (Epoxy SMP)
CRG has developed a unique shape memory polymer
(SMP) material, Veriflex E, with the versatile shape memory
properties of styrene SMP, but with the toughness and strength
of epoxy. Veriflex E is inherently tough and more convenient
to process and use. It exhibits over 100% elongation with
full recovery. Veriflex E can be tailored with a transition
temperature ranging from 80° C to 130° C. One formulation
has successfully passed out-gassing evaluation, making it
viable for space-based applications.
CRG’s epoxy SMP is a high-performance
material, providing the SMP properties of Veriflex with added
toughness. Veriflex E is formulated from common resins and
curing agents. Like the styrene version, it can be cast and
cured into a variety of “memorized” shapes. Veriflex
E has a very sharp storage modulus transition curve, indicating
its quick recovery to the “memorized” shape when
heated past its transition temperature. This illustrates the
fast transition of the material between rigid and elastic
states.
The SMP properties along with its ease of processing
make Veriflex E an attractive material for many terrestrial,
aerospace, and space-based applications. Suited for most composite
processing methods, Veriflex E enables wider use and new applications
for SMP materials. (3-30-2006)
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